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摘译虽然目前3D集成电路(3D IC)制造技术正在如火如茶的发展,但专家们一致认为该领域在技术和材料选择、设计、测试及其他关键研究上仍然具有挑战性。3D IC市场正逐渐发展为三个主要的部分:先通孔,中间通孔(使用Cu或者W TSVs制造的),后通孔(使用Cu制造,主要用于包装工业)。现在被称为2.5D的中介层式结构属于最后一类。硅体中介层可能是一个有效的中间解决方案,而且有望应用于规模生产。在以上方法中,薄膜聚合物和光致抗蚀剂都是必须的材料。对于某些3D方法来说,在聚合物沉积过程中,形貌是真正的挑战,如具有锥形侧壁的图像传感器的3D包装工艺。
Although the current 3D IC manufacturing technology is in full swing, experts agree that the field remains challenging in terms of technology and material selection, design, testing and other key research. The 3D IC market is evolving into three major areas: first via, middle via (made of Cu or WTSVs) and back via (made of Cu, mainly for the packaging industry). The now mediocre structure called 2.5D belongs to the last category. Silicone interposers may be an effective intermediate solution and are expected to be applied to mass production. In the above method, both thin film polymers and photoresists are necessary materials. For some 3D methods, topography is a real challenge during polymer deposition, such as the 3D packaging process for image sensors with tapered sidewalls.