众所周知,采用碱性湿刻液,尤其是氢化钾(KOH)溶液的(110)硅片各向异性刻蚀,作为一种加工手段,可获得其它方式难以获得的垂直且高纵横比形状.同时,其刻蚀侧面,即(111)晶面,可达到非常平滑的程度.新制作的具有上述特点的硅板,由于其侧面为垂直的镜面,旦作为微型元件具有较大的面积(100μm~2以上)因此,人们期待能作为自由空间用微光学元件、尤其是作为微反射镜和光学平面应用.此外,高纵横比加工,利用可能的优势,可形成宽2μm、深200μm这样的窄通道,这种结构,根据大面积、窄通道的特点,适于在能获得高驱动力的静电致动器方面应用.同时,为形成无内部残余应力的单晶,可制作很长的悬臂梁,以实现低电压驱动的静电 It is well known that anisotropic (110) wafer etching using alkaline wet etchants, especially potassium hydride (KOH) solutions, as a processing means, makes it possible to obtain vertically and high aspect ratio shapes otherwise difficult to obtain , The etching of the side, that is, (111) crystal face, can reach a very smooth degree.Newly fabricated silicon board with the above characteristics, because of its vertical side of the mirror, once as a micro-component has a large area (100μm ~ 2 or more) Therefore, it is expected to be used as a free-space micro-optical element, especially as a micromirror and an optical plane application. In addition, high aspect ratio processing makes use of possible advantages to form narrow channels of 2 m in width and 200 m in depth , This structure, according to the characteristics of large area, narrow channel, suitable for electrostatic actuators to obtain high driving force applications.At the same time, in order to form a single crystal without internal residual stress, can make a long cantilever, In order to achieve low-voltage-driven static electricity