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许多嵌套应用都要求有μP和DSP的混合功能;为此, 半导体厂家正在研制混合式器件,以解决这两种产品的处理功能。在用分立式μP和DSP器件做新的设计前,应先考察一下用这些混合式器件的得失利弊。
Many nested applications require a mix of μP and DSP functions; for this reason, semiconductor manufacturers are developing hybrid devices to address the processing power of both products. Before making a new design with discrete μP and DSP devices, consider the pros and cons of using these hybrid devices.