霍尼韦尔公司2009年3月17日宣布已研制出一种新的无铅封装技术,可以改善半导体芯片的导热性能。新产品称作霍尼韦尔无铅芯片连接焊线,是一种不含铅的热界面材料,旨在提高半导体芯片的散热性能及可靠性。随着半导体器件功能越来越强大而尺寸越来越纤小,当半导体芯片在封装后用于 Honeywell announced on March 17, 2009 that it has developed a new lead-free packaging technology that improves the thermal conductivity of semiconductor chips. Called Honeywell’s lead-free chip bond wire, the new product is a lead-free thermal interface material designed to improve the thermal performance and reliability of semiconductor chips. As semiconductor devices become more powerful and smaller in size, when the semiconductor chip is packaged