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采用热压成型工艺,制备了一种低损耗ZrTi2O6陶瓷填充聚四氟乙烯(PTFE)的新型微波复合基板材料。采用介质谐振器法研究了ZrTi2O6/PTFE复合材料的微波介电性能(8~12GHz)。结果表明,ZrTi2O6/PTFE复合材料的相对介电常数(εr)和介电损耗(tanδ)随着ZrTi2O6陶瓷体积分数(0~46%)的增加而增大,介电常数实验值与Lichtenecker模型预测值最吻合。ZrTi2O6/PTFE复合材料的热膨胀系数和介电常数温度系数随着ZrTi2O6陶瓷体积分数的增加而减小。46%的ZrTi2O6为较优填料比例,ZrTi2O6/PTFE的相对介电常数为7.42,介电损耗为0.0022(10GHz)。
A new type of microwave composite substrate with low loss ZrTi2O6 ceramic filled polytetrafluoroethylene (PTFE) was prepared by hot press molding. The microwave dielectric properties of ZrTi2O6 / PTFE composites (8 ~ 12GHz) were investigated by dielectric resonator method. The results show that the relative permittivity (εr) and dielectric loss (tanδ) of ZrTi2O6 / PTFE composites increase with the increase of volume fraction of ZrTi2O6 ceramics (0 ~ 46%). The experimental data of dielectric constant and Lichtenecker model predict The most consistent value. ZrTi2O6 / PTFE composite thermal expansion coefficient and dielectric constant temperature coefficient decreases with increasing volume fraction of ZrTi2O6 ceramics. 46% ZrTi2O6 is the preferred filler ratio, ZrTi2O6 / PTFE has a relative dielectric constant of 7.42 and a dielectric loss of 0.0022 (10 GHz).