更多挑战典型WCSP工艺的一个常见问题是缺少最终封装测试。大多数情况下,最终电气测试都是在凸块回流后在晶圆层进行。因此,在制造过程的这一“后端”部分,必须进行高强度的目视检查,其包括激光标记、切割和封装。随着这种封装进入汽车和医疗行业,工艺控制和质量检查系统便成为必需。 More Challenges A common problem with typical WCSP processes is the lack of final package testing. In most cases, the final electrical test is performed on the wafer layer after bump reflow. Therefore, in this “back-end” part of the manufacturing process, a high-intensity visual inspection, including laser marking, cutting and packaging, has to be done. With this package entering the automotive and medical industries, a process control and quality inspection system has become necessary.