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一、引言随着大规模集成电路和集成光学的不断发展,对加工技术的要求越来越高,如目前提出图形的精细化,过程低温化,掺杂薄层化及可控性优化等,而准分子激光器则以它能量高、波长短(200～400nm)等优点为解决这些问题提供了有利条件。于是,八十年代开始形成了准分子微细加工新兴技术领域。准分子激光微细加工大体可分为激光曝光技术,激光CVD
I. INTRODUCTION With the continuous development of large-scale integrated circuits and integrated optics, the requirements on the processing technology are getting higher and higher. For example, the present invention proposes the refinement of graphics, the low temperature process, the doping thinning and the controllability optimization, The excimer laser with its high energy, short wavelength (200 ~ 400nm) and other advantages to solve these problems provide favorable conditions. Thus, the eighties began to form the emerging field of excimer micro-processing technology. Excimer laser micro-processing can be roughly divided into laser exposure technology, laser CVD