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本文主要是用温度光弹性法,通过模型试验来研究半刚性基层沥青路面的温度应力状态和路面结构的开裂机理.研究结果表明,温度应力是引起路面开裂的主要原因.文中还较详细地分析了路面开裂后,裂纹扩展规律和裂纹稳定性问题.
In this paper, temperature photoelasticity method is used to study the temperature stress state of semi-rigid base asphalt pavement and cracking mechanism of pavement structure through model test.The results show that temperature stress is the main reason causing pavement cracking.This paper also analyzes in more detail After pavement cracking, crack propagation and crack stability problems.