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采用超声电沉积法制备了一种纯铜叠层膜,用扫描电镜、X射线衍射分析、腐蚀失重实验以及电化学测试等手段分析了其显微组织与耐腐蚀性能。结果表明:得到的铜叠层膜每层厚度约为0.3μm,微观结构极为致密;其(200)与(111)晶面取向明显增强,(220)取向则显著减弱。其在20%HNO_3溶液中开始冒气泡的时间(380 s)比普通电沉积铜薄膜(148 s)延迟了近3倍,腐蚀速率明显降低;电化学测试表明,其自腐蚀电位明显高于普通电沉积铜薄膜,自腐蚀电流仅为后者的不到1/5,说明其耐腐蚀性能得到了显著提高。
A pure copper laminated film was prepared by ultrasonic electrodeposition. The microstructure and corrosion resistance of the pure copper film were analyzed by scanning electron microscopy, X-ray diffraction analysis, loss-of-weight test and electrochemical test. The results show that the thickness of each layer of copper laminated film is about 0.3μm, and the microstructure is very dense. The orientations of (200) and (111) planes are obviously enhanced and the orientation of (220) is significantly weakened. The time of bubbling in the solution of 20% HNO 3 (380 s) was nearly 3 times of that of ordinary electrodeposited copper film (148 s), and the corrosion rate obviously decreased. The electrochemical test showed that the self-corrosion potential was significantly higher than that of the normal Electrodeposited copper film, the corrosion current is only less than 1/5 of the latter, indicating that its corrosion resistance has been significantly improved.