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增长机载电子设备可靠性指标的有效途径之一是数字电路的小型化。本文通过计算航空电子总线接口模块（ＭＢＩ）的小型化过程三个阶段（采用中小规模集成电路设计ＭＢＩ；采用超大规模集成电路和ＡＳＩＣ技术设计ＭＢＩ；采用ＳＭＴ表面封装和二次集成技术设计ＭＢＩ）的可靠性预计指标，说明数字电路小型化可以使机载电子设备可靠性增长。
One of the effective ways to increase the reliability of airborne electronic equipment is to miniaturize digital circuits. In this paper, three stages of miniaturization of the avionics bus interface module (MBI) are calculated (using MBI for small and medium scale integrated circuits; designing MBI with VLSI and ASIC technology; designing MBI with SMT surface-mount and secondary integration) The reliability of the indicators, indicating the miniaturization of digital circuits can increase the reliability of airborne electronic devices.