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分别研究了SnBi钎料和添加0.1%的微米级Fe颗粒的SnBi复合钎料的电迁移现象。结果表明:随着通电时间的增加,SnBi钎料显微组织发生明显的粗化,白色的富Bi相尺寸不断增加,阳极和阴极IMC厚度呈现极性效应,抗拉强度变化明显。当添加Fe颗粒后,随着通电时间的增加,SnBi-Fe复合钎料的显微组织粗化不明显,阴极和阳极界面IMC厚度变化减缓,复合钎料接头的抗拉强度变化减缓。这表明Fe颗粒可以有效抑制SnBi钎料的电迁移。
The electromigration of SnBi brazing filler metal and SnBi composite filler metal with 0.1% micron-sized Fe particles has been studied respectively. The results show that the microstructure of SnBi brazing material is obviously roughened with the increase of the energization time. The white Bi-rich phase size increases continuously. The thickness of anode and cathode IMC shows the polar effect, and the tensile strength changes obviously. With the addition of Fe particles, the microstructure of SnBi-Fe composite brazing did not change significantly with the increase of energization time, and the change of the thickness of IMC at the cathode and anode interface was slowed down. The change of tensile strength of the composite solder joint slowed down. This shows that Fe particles can effectively inhibit the electromigration of SnBi solder.