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对经过连续铸造、固溶处理和冷拉拔的Cu-1.5%Cr合金进行时效处理,研究了时效温度和时效时间对该合金组织与性能的影响,并对该合金在不同温度下的时效行为进行了分析。结果表明:Cu-1.5%Cr合金经450℃时效3h处理后可以获得较好的综合性能,合金的显微硬度为HV235,导电率达到73.4%IACS。时效过程合金中Cr的脱溶使合金基体贫铬化而析出相富铬化,发生Cr元素的再分配。时效态Cu-1.5%Cr合金的断裂机制为微孔聚集型断裂。
The effects of aging temperature and aging time on the microstructure and properties of Cu-1.5% Cr alloy after continuous casting, solution treatment and cold drawing were studied. The aging behavior of the alloy at different temperatures Analyzed. The results show that the Cu-1.5% Cr alloy can be well treated by aging at 450 ℃ for 3h. The microhardness of the alloy is HV235 and the conductivity reaches 73.4% IACS. During the aging process, the desolventizing of Cr alloy makes the matrix of the alloy lean and the precipitated phase is chromated, and the redistribution of Cr element occurs. The fracture mechanism of aging Cu-1.5% Cr alloy is micropore aggregation type fracture.