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通过正交试验研究了TC4钛合金的真空扩散连接工艺,进行了扩散连接接头的剪切强度试验。通过光学显微镜(OM)、扫描电镜(SEM)等分析手段,研究扩散连接温度、压力、时间等参数对TC4真空扩散连接质量及扩散连接接头剪切强度的影响。结果表明:扩散连接温度920℃,压力3 MPa,保温保压30 min时,扩散连接界面完全与基体相融,局部微孔等缺陷基本消失,孔洞弥合率达到98.63%,扩散连接接头的剪切强度为467.83 MPa,达到了母材剪切强度(480MPa)的97.46%。
The orthogonal experiment was used to study the vacuum diffusion bonding process of TC4 titanium alloy, and the shear strength test of diffusion bonded joints was carried out. The influences of diffusion bonding temperature, pressure and time on the quality of TC4 vacuum diffusion bonding and the shear strength of diffusion bonded joints were studied by optical microscope (OM) and scanning electron microscope (SEM). The results show that when the diffusion bonding temperature is 920 ℃, the pressure is 3 MPa and the holding pressure is 30 min, the diffusion bonding interface completely melts with the matrix, the defects such as local micropores disappear, and the occlusion rate reaches 98.63%. The shear of the diffusion bonding joint The strength was 467.83 MPa, reaching 97.46% of the base metal shear strength (480 MPa).