近十年来,扫描电镜(SEM)一直用在复杂集成电路的失效分析这个毫无疑义的质量控制中。但这些应用大多是作金属布线的连续生、线宽、金属膜厚度和结深的半定量测试,以及电压对比法和电子束射感应电导率(EBIC)的定性测量或桥接线的观察等。由于复杂集成电路的图形尺寸正在缩小,为了得到比 For nearly a decade, scanning electron microscopy (SEM) has been used in the unquestionable quality control of failure analysis of complex integrated circuits. However, most of these applications are semi-quantitative tests for continuous wiring, line width, metal film thickness and junction depth of metal wiring as well as qualitative measurement of voltage contrast method and electron beam induced conductivity (EBIC) or observation of bridge wires. As complex graphics size is shrinking, in order to get the ratio