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化学沉积镍磷合金层是利用强还原剂次磷酸钠,使溶液中硫酸镍的镍阳离子还原成金属镍,并沉积在零件表面上;同时次磷酸钠分解,产生磷原子也进入沉积层内。当其磷含量较低(小于7～8％)时,沉积层为过饱和的镍磷固溶体。这一过程必需在有催化表面的条件下才能进行。化学沉积镍磷合金与电镀不同之处在于:电镀是利用电能将镍阳离子还原成金属镍并沉积在阴极上;而化学沉积是在无电源条件下,用化学还原方
Chemical deposition of nickel-phosphorus alloy layer is the use of strong reductant sodium hypophosphite, the solution of nickel sulfate nickel cation was reduced to nickel metal, and deposited on the surface of the parts; the same time sodium hypophosphite decomposition, phosphorus atoms also enter the sedimentary layer. When its phosphorus content is lower (less than 7 ~ 8%), the sedimentary layer is supersaturated nickel-phosphorus solid solution. This process must be carried out under the condition of a catalytic surface. Chemical deposition Nickel Phosphor and electroplating difference is that: electroplating is the use of electricity to reduce nickel cations nickel metal and deposited on the cathode; and chemical deposition is in the absence of power conditions, with chemical reduction side