对某复合材料厂生产的20-TiC铜合金的动态再结晶行为进行了研究和分析,并且对实测的应力-应变曲线进行了拟合。结果表明:拟合的应力-应变曲线平滑无波浪,比较适宜研究材料的动态再结晶行为。根据拟合的应力-应变曲线可知,在一定的变形温度下,应变速率越大,应力最大值越大,在一定的应变速率下,变形温度越高,应力最大值越小。通过应力-应变曲线可以得到材料动态再结晶的临界应变值。 The dynamic recrystallization behavior of 20-TiC copper alloy produced in a composite plant was studied and analyzed, and the measured stress-strain curves were fitted. The results show that the fitted stress-strain curve is smooth and wave-free, and it is more suitable to study the dynamic recrystallization behavior of the material. According to the fitted stress-strain curves, under a certain deformation temperature, the larger the strain rate, the larger the maximum stress. Under a certain strain rate, the higher the deformation temperature, the smaller the maximum stress. Through the stress-strain curve, the critical strain value of dynamic recrystallization can be obtained.