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采用气体雾化法研制了SMT用免清洗型软钎膏的锡基合金焊粉,其合金成分及杂质元素含量达到美国QQ-S-571E和日本JIS-Z-3282A级标准,氧化物含量达到美国Multicore公司无氧焊粉的标准,一次出粉率平均达到70%以上。
The gas-atomization method was used to develop the tin-based alloy solder powder with no-clean solder paste for SMT. Its alloy composition and impurity element content reached the standards of American QQ-S-571E and Japanese JIS-Z-3282A with the oxide content reaching American Multicore oxygen-free solder powder standard, an average rate of more than 70% flour.