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采用电沉积工艺制备碳纳米管(CNT)均匀分布但铺设方式不同的超顺排碳纳米管(SACNT)薄膜增强铜基层状复合材料。结果表明,当SACNT膜的体积分数为5.0%且正交铺设时,复合材料的抗拉强度和屈服强度最大可达336.3 MPa和246.0 MPa,相比于同种条件下所制备的纯铜,分别提高了74.0%和124.5%。所制备的复合材料的导电性均大于75%IACS。透射电镜分析结果表明,SACNT的加入能细化基体中铜晶粒的尺寸和孪晶片的厚度,并且正交铺设复合材料中的细化效应比单向铺设复合材料中的更显著。Cu/SACNT复合材料的高强度不仅源于SACNT的增强作用,还与CNT铺设方式导致的铜基体晶粒细化有关。
Electrodeposition was used to prepare superconducting carbon nanotubes (SACNT) thin film reinforced copper matrix composite with uniform distribution of carbon nanotubes (CNTs) but different laying methods. The results show that when the volume fraction of SACNT membrane is 5.0% and laid orthogonally, the tensile strength and yield strength of the composites can reach 336.3 MPa and 246.0 MPa, respectively. Compared with the pure copper prepared under the same conditions, Increased by 74.0% and 124.5%. The prepared composite materials all have conductivity greater than 75% IACS. The results of TEM showed that the addition of SACNT could refine the grain size of copper matrix and the thickness of the twins in the matrix, and the refining effect in the orthogonally laid composites was more remarkable than that in unidirectional laid composites. The high strength of Cu / SACNT composites not only originated from the enhancement of SACNT, but also related to the grain refinement of Cu matrix due to CNT lay-up.