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在航空电子电路设计和温度监控过程中,为保证电子元件安装部位的温度不超过允许值,需要对板翅热沉温度进行准确分析。而在发热元件为非均匀热源作用下的冷板表面温度显式解析解,可提供电子元件发热量与航空电子设备各点温升的直观了解。本文建立了板翅式冷板的三维瞬态传热模型,提出了板翅式冷板的热模拟解析求解方法,通过算例计算了板翅式冷板在非均匀热流密度下电子元件不同安装位置的瞬态温升。分析解结果与试验测量结果误差不超过3K。
In the avionics circuit design and temperature monitoring process, in order to ensure the temperature of the electronic components installed parts does not exceed the allowable value, the need for accurate analysis of the fin heat sink temperature. The explicit analysis of the surface temperature of the cold plate under the effect of the non-uniform heating element can provide an intuitive understanding of the heating value of the electronic components and the temperature rise of each point of the avionics. In this paper, a three-dimensional transient heat transfer model of a plate-finned cold plate is established and a thermal simulation analytical solution of the plate-fin plate is proposed. The numerical simulation of different installation of electronic components under non-uniform heat flux Location of the transient temperature rise. Analytical results and experimental measurement error does not exceed 3K.