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日本第十六届“离子注入和亚微米加工”会议于今年3月11日～12日在日本东京召开。我们(长沙半导体工艺设备研究所何喜冠、吴关寿,北京真空电子器件研究所彭自安,平凉半导体专用设备研究所熊锋)作为电子工业部代表团应邀参加了这次会议。 “离子注入和亚微米加工”会议是由日本学术振兴会、日本应用物理学会等单位举办的全国性学术会议,主要参加单位是日本的大学、公司的中央研究所,半导体器件研究所及有关生产厂家,同时邀请少数外国学者参加。
Japan’s 16th “ion implantation and sub-micron processing” conference held in Tokyo, Japan from March 11 to 12 this year. We (He Xiguan, Wu Guanshou, Institute of Semiconductor Process Equipment, Changsha, Peng Zi’an, Beijing Institute of Vacuum Electronics, Xiong Feng, Institute of Semiconductor Equipment, Pingliang) were invited to attend this meeting as a delegation from the Ministry of Electronics Industry. The “Ion Implantation and Submicron Machining” Conference is a national academic conference held by Japan Society for the Promotion of Science and Japan Society of Applied Physics. The main participating units are Japanese universities, the company’s Central Research Institute, the Institute of Semiconductor Devices and the related production Manufacturers, also invited a few foreign scholars to participate.