论文部分内容阅读
采用示差扫描量热法(DSC)和热失重分析法(TGA)研究了环氧树脂含量对氰酸酯树脂固化反应特性、热稳定性以及热膨胀系数的影响。结果表明,环氧树脂的加入可有效降低改性体系的固化反应活化能,同时体系的热稳定性和尺寸稳定性有不同程度的削弱。当环氧树脂质量分数达到20%时,改性体系的表观活化能为65.4 kJ/mol,耐热温度指数为174℃,较纯氰酸酯树脂分别降低了25.8%和21.4%。当环氧树脂质量分数达到50%时,改性体系的热膨胀系数为65.3 922×10-6/℃(25~150℃),较纯氰酸酯树脂提高了8.13%。
The effects of epoxy content on curing reaction, thermal stability and thermal expansion coefficient of cyanate ester resin were investigated by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The results show that the addition of epoxy resin can effectively reduce the curing reaction activation energy of the modified system. At the same time, the thermal stability and dimensional stability of the system are weakened to some extent. When the mass fraction of epoxy resin reaches 20%, the apparent activation energy of the modified system is 65.4 kJ / mol and the heat resistance temperature index is 174 ℃, which is 25.8% and 21.4% lower than the pure cyanate resin respectively. When the mass fraction of epoxy resin reaches 50%, the thermal expansion coefficient of the modified system is 65.3 922 × 10-6 / ℃ (25 ~ 150 ℃), which is 8.13% higher than the pure cyanate resin.