本文是关于具有优异导电率和导热率的封接用的合金复合板。在电子管和半导体器件中,与玻璃、陶瓷或硅半导体封接时,为了得到较小的因温度变化而产生的内应力,则需使用与匹配对象的非金属乃至半金属的热膨胀系数相近的金属,即以前使用了膨胀系数为(0.4～1.2)×10~(-5)/℃左右的Fe-Ni-Co、Fe-Ni或Fe-Cr等铁合金。虽然这些合金具有良好的封 This article is about an alloy sheet for sealing with excellent electrical conductivity and thermal conductivity. In electron tubes and semiconductor devices, when sealing with glass, ceramics or silicon semiconductors, in order to obtain smaller internal stress due to temperature changes, it is necessary to use a metal having a thermal expansion coefficient close to that of a nonmetal or semimetal to be matched , That is, an iron alloy such as Fe-Ni-Co, Fe-Ni, or Fe-Cr having an expansion coefficient of about (0.4 to 1.2) × 10 -5 / Although these alloys have a good seal