论文部分内容阅读
化合物半导体材料的应用经历了稳定的增长,尤其是在光电子产业中更为典型。这些材料的应用要求在封装之前需将衬底减薄到100μm以下。由于这种材料的易碎性,需要某种支持方式来通过各种工序对衬底进行处理。半导体行业中建造这种支持最公认的方法是临时固定这种衬底材料到刚性载体基底上。介绍了一种用全自动方式固定和解固定这类衬底的技术。通过采用各种中间基底,包括热和紫外光释放的能够预先准备和薄片状的全自动化干式黏性膜。200mm直径的这种衬底可以以片盒到片盒的方式键合到晶圆平面的这种载体上。本工艺中选用了一种保护性涂层到衬底上。一旦这种衬底固定后,便可以完成随后的减薄、通孔印刷等工序。当这种衬底被减薄和背面处理之后,第二道加工便用于从载体上解键合该衬底,再次以片盒到片盒的方式将其固定到划版的薄膜或类似的载体上。
The use of compound semiconductor materials has experienced a steady growth, especially in the optoelectronics industry. The application of these materials requires that the substrate be thinned to less than 100 μm prior to packaging. Due to the fragility of this material, some kind of support is needed to process the substrate through various processes. The most recognized way to build this support in the semiconductor industry is to temporarily affix this substrate material to a rigid carrier substrate. A technique for fixing and unfastening such substrates in a fully automated manner is presented. Through the use of a variety of intermediate substrates, including the release of heat and UV light can be prepared in advance and sheet-like fully automatic dry sticky film. A 200 mm diameter substrate of this type can be bonded to such a carrier on the wafer level in a chip-to-cassette manner. In this process, a protective coating is applied to the substrate. Once this substrate is fixed, the subsequent thinning, through-hole printing and other processes can be completed. After the substrate is thinned and backside processed, the second pass is used to unbonded the substrate from the carrier and again to the stencil sheet or similar carrier in the form of a cassette-to-cassette .