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三年以前,当約飞院士在其专著中論述我们对于半导休知識的近况时写道:“在半导体中,有一些材料具有特别高的熔点,超过4000℃,有一些村料具有非常高的硬度,它的热导率超过金属的热导率,但是所有这些半导体的性质没有引起人们的注意,沒有被人研究。实用上的需要一再要求扩大半导体的研究領域——更深入地研究多組份体系、比电阻小的半导体、高温度的和超硬度的材料。”在化学、冶金、动力学及其他与自动化任务相結合的工业部门中,高温过程的发展越来越显著地强調需要制造能可靠地在高温条件下而同时又受腐蚀性介质作用的情况下应用的半导体。在不少情况下,还要能
Three years ago, when academician Feiyue wrote in his monograph about our recent knowledge of semiconductor technology, “Some of the materials in semiconductors have exceptionally high melting points above 4000 ° C and some have very high , Its thermal conductivity exceeds the thermal conductivity of metals, but the properties of all of these semiconductors have not attracted much attention and have not been studied. The practical need has repeatedly demanded the expansion of the field of semiconductors - more in-depth study Component systems, semiconductors with lower resistance, materials of higher temperature and hardness. ”In the industrial sector, which combines chemical, metallurgy, kinetics and other tasks with automation, the development of high-temperature processes is increasingly emphasized There is a need to manufacture semiconductors that can be reliably applied under high temperature conditions while being affected by corrosive media. In many cases, but also can