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本文简要地叙述了正性光刻胶的基本特性,详细地讨论了它的感光机理和工艺参数的选择。从理论和实践上解决了正性光刻胶在圆分划元件光刻中的应用和工艺最佳化,并刻出了不同直径的较为满意的圆分划元件。
This article briefly describes the basic characteristics of the positive photoresist, discussed in detail its sensitivity mechanism and process parameters of choice. In theory and practice, it solves the application and process optimization of positive photoresist in the circle division lithography and engraves the more satisfactory circle division elements of different diameters.