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采用Cu-Ti+Mo复合焊料,在真空条件下对2DC/SiC复合材料和GH783镍基合金进行连接,分析接头的显微组织结构,研究Mo含量对接头组织及性能的影响。结果表明:接头由界面反应层、应力缓解层、软金属层和扩散层4个区域组成,接头致密,无孔洞、裂纹等缺陷。随着Mo含量的增加,接头的连接强度不断增加;当Mo含量为15%(体积分数)时,接头连接强度达到最大(141MPa);当Mo含量大于15%时,接头的连接强度开始下降。Mo的加入,缓解了接头的残余应力、抑制了Ti对C/SiC的过度侵蚀,从而有效提高接头的连接强度。
The Cu-Ti + Mo composite solder was used to connect the 2DC / SiC composites and the GH783 nickel-base alloy under vacuum. The microstructure of the joint was analyzed and the effect of Mo content on the microstructure and properties of the joint was investigated. The results show that the joints are composed of four interfaces: interface reaction layer, stress relaxation layer, soft metal layer and diffusion layer. The joints are dense, without holes and cracks. The joint strength increases with the increase of Mo content. When the Mo content is 15% (volume fraction), the joint strength reaches the maximum (141MPa). When the Mo content exceeds 15%, the joint strength begins to decrease. The addition of Mo alleviates the residual stress of the joint and suppresses Ti from over-attacking the C / SiC so as to effectively improve the connection strength of the joint.