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专利申请号:CN201110206343.X公开号:CN102357525A申请日:2011.07.22公开日:2012.02.22申请人:西安建筑科技大学本发明公开了一种多层铜/钼结构复合板的制备方法,该方法制备的多层铜/钼结构复合板是两层铜板之间有一层钼板,而且铜板层和钼板层之和至少有5层,制备方法包括表面处理、叠合、单道次热轧复合、中间退火,累积轧制多层复合板、成品退火及后续加工。此方法制备的铜/钼多层材料在轧制
Patent application CN201110206343.X Publication Number CN102357525A Application date: 2011.07.22 Publication date: 2012.02.22 Applicant: Xi’an University of Architecture and Technology The invention discloses a method for preparing a multi-layer copper / molybdenum structure composite board, which comprises the following steps: The prepared multi-layer copper / molybdenum composite plate has a molybdenum plate between the two copper plates and at least five layers of copper plate and molybdenum plate. The preparation method includes the surface treatment, the lamination, the single-pass hot-rolling compounding , Intermediate annealing, cumulative rolling multi-layer composite board, finished annealing and subsequent processing. The copper / molybdenum multilayer material prepared by this method is rolled