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化学气相沉积(CVD)起始于19世纪末,先后用于钛、锆等金属的提纯以及金属丝和金属板的耐磨、耐热表面保护。本世纪50年代西德金属协会化学气相沉积炭化钛的成功,使这项技术达到实用化阶段。60年代在原子能、宇航和半导体等工业中获得广泛应用。继之又发展了物理气相沉积(PVD)。1963年Mattox开发了离子镀。1972年Bunshah开发了活性反应蒸镀(ARE)。各种形式的反应性PVD相继出
Chemical vapor deposition (CVD) began in the late nineteenth Century, has been used for titanium, zirconium and other metal purification and metal wire and sheet wear-resistant, heat-resistant surface protection. The success of the chemical vapor deposition of titanium carbide in the West German Metals Society in the 1950s brought the technology to practical use. 60’s in the atomic energy, aerospace and semiconductor industries have been widely used. Followed by the development of physical vapor deposition (PVD). 1963 Mattox developed ion plating. 1972 Bunshah developed reactive deposition (ARE). Various forms of reactive PVD are followed