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通过回流焊工艺制备了Sn0.7Cu-x Er/Cu(x=0,0.1,0.5)钎焊接头,研究钎焊温度及等温时效时间对接头的界面金属间化合物(IMC)的形成与生长行为的影响。结果表明:Sn0.7Cu钎料中微量稀土Er元素的添加,能有效抑制钎焊及时效过程中界面IMC的形成与生长。在等温时效处理过程中,随着时效时间的延长,界面反应IMC层不断增厚,在相同时效处理条件下,Sn0.7Cu0.5Er/Cu焊点界面IMC层的厚度略小于Sn0.7Cu0.1Er/Cu焊点界面的厚度。通过线性拟合方法,得到Sn0.7Cu0.1Er/Cu和Sn0.7Cu0.5Er/Cu焊点界面IMC层的生长速率常数分别为3.03×10–17 m2/s和2.67×10–17 m2/s。
The Sn0.7Cu-xEr / Cu (x = 0,0.1,0.5) brazed joints were prepared by reflow soldering. The formation and growth behavior of interfacial intermetallic compounds (IMC) at brazing temperature and isothermal aging time Impact. The results show that addition of rare earth element Er in Sn0.7Cu solder can effectively restrain the formation and growth of IMC during brazing and aging. In the isothermal aging process, with the aging time, the interfacial reaction of IMC layer thickening continuously, under the same aging conditions, the thickness of the Sn0.7Cu0.5Er / Cu solder joint interface IMC layer is slightly smaller than the Sn0.7Cu0.1Er / Cu solder joint interface thickness. Through the linear fitting method, the growth rate constants of IMC layer of Sn0.7Cu0.1Er / Cu and Sn0.7Cu0.5Er / Cu solder joints are 3.03 × 10-17 m2 / s and 2.67 × 10-17 m2 / s respectively .