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本文提出卷对卷纳米压印脱模的两种形式并分析了脱模过程中的阻力。选取垂直于光栅形微结构的截面作为研究对象,忽略脱模过程中旋转角度的影响,将模板上微结构当作竖直平移脱离胶层的方式来处理,利用ANSYS有限元软件模拟了卷对卷脱模过程中不同位置的变形和等效应力分布。结果显示脱模过程中出现两处应力集中,且应力集中处的最大应力在脱模刚发生时出现波动,随后逐渐增大。
This paper presents two forms of roll-to-roll nanoimprint demolding and analyzes the resistance during demolding. Select the cross section perpendicular to the grating-shaped microstructure as the research object, neglecting the influence of the rotation angle in the process of demolding, treat the microstructure on the template as the vertical translation away from the glue layer, and use ANSYS finite element software to simulate the volume pair Deformation and Equivalent Stress Distribution in Different Positions During Strip Demolding. The results show that there are two stress concentrations in the process of demolding, and the maximum stress in the stress concentration area fluctuates immediately after demolding, and then increases gradually.