本文通过测定正拉和拉剪试样连续几次拉断后胶接面上的显微硬度分布，研究了胶接接头受载时应力的分布情况和断裂过程。结果表明被粘物表层存在着较大的显微硬度波动，确已发生了一定量的塑性变形，且某些区域存在着残余应力。同时也表明，试样受载时，正应力及剪应力的分布是不均匀的。如果所用过的试样不经处理，从新使用，当其受载时，粘接面上会继续发生塑性变形，且试样上正应力和剪应力的分布会变得更加不均匀。 In this paper, the distribution of the stress and the fracture process of the bonded joint under load were studied by measuring the distribution of microhardness of the bonded surface after several consecutive pull-off tests. The results show that there is a large microhardness fluctuation in the surface of the adherend, a certain amount of plastic deformation has indeed occurred, and residual stress exists in some areas. It also shows that the distribution of normal stress and shear stress is not uniform when the specimen is loaded. If the used specimen is untreated and reused, plastic deformation will continue to occur on the bonding surface as it is loaded, and the distribution of normal and shear stress on the specimen will become more uneven.