利用光刻热熔法及氩离子束刻蚀技术制作１２８×１２８元面阵硅场发射器件，采用扫描电子显微镜（ＳＥＭ）和表面探针等测试手段分析所制成的面阵硅微尖阵列和硅微台（微环尖）阵列的表面微结构形貌特点．所制成的面阵硅微尖和硅微台（微环尖）器件的图形整齐均匀，达到了预定的各项指标的要求．实验表明，所采用的器件制作方法有较大的实用价值． The 128 × 128 element array silicon field-emission devices were fabricated by photolithography and thermal ionization and argon ion beam etching. The surface array silicon microdot arrays were fabricated by scanning electron microscopy (SEM) and surface probe. And micro-micro-silicon platform (micro-ring tip) array of micro-structure features. The resulting array of silicon micro-tip and micro-micro-silicon (micro-ring tip) devices, the shape of the device neat and uniform, reaching a predetermined target of the requirements. Experiments show that the device used in the production method has greater practical value.