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二、红外遥控部分 红外线遥控部分由手机的编码信号合成集成块(M50560-200FP)配对机芯内中央微处理器(MN15142TEAl)解码处理组成。该部分电路属于数字大规模集成电路,故障率本应极低,但使用日久,线路的焊点小而薄,接插件易出现氧化、断裂,外围元件也偶有失效损坏,导致遥控或部分功能失效,对这部分电路应首先检查线路相关焊点、接插件(最好用10倍以上放大镜仔细观察),其次要准确地判断究竟是中央微处理器IC1102及其所属的外围控制电路出故障,还
Second, the infrared remote control part of the infrared remote control by the phone’s encoded signal synthesis manifold (M50560-200FP) pairing movement within the central microprocessor (MN15142TEAl) decoding process. The part of the circuit is a digital LSI, the failure rate should be extremely low, but the use of time, the circuit of small and thin solder joints, connectors prone to oxidation, fracture, peripheral components are also occasionally damaged failure, resulting in remote control or part of Function failure, this part of the circuit should first check the line-related solder joints, connectors (preferably 10 times more magnifying glass carefully observed), followed by accurately determine whether the central microprocessor IC1102 and its peripheral control circuit failure ,also