更小的几何图形在集成电路中的应用促进了硅工艺的发展。这些微小的几何图形使芯片集成密度得到提高。同时,使复杂的大规摸集成电路的成本降低。我们正在迅速地逼近可见光或紫外光的硅工艺技术极限。电子束和 X 射线技术在高密度电路中越来越显得格外重要。本文讨论了亚微米工艺的重要性。探索了未来的发展速度,并研究一般亚微米流程。 The use of smaller geometries in integrated circuits has led to the development of silicon processes. These tiny geometries increase chip integration density. At the same time, the cost of complex large scale integrated circuits is reduced. We are rapidly approaching the limits of silicon technology for visible or ultraviolet light. E-beam and X-ray technologies are becoming more and more important in high-density circuits. This article discusses the importance of sub-micron processes. Explored the pace of future growth, and studied the general submicron process.