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本文先从理论角度说明了薄膜结构性能变化中存在“温度临界点”,然后借助于XRD、Ram an等测试仪器研究分析了S i薄膜、AZO薄膜在晶化过程、晶粒长大过程以及性能突变中的“温度临界点”。结果显示:薄膜结构性能变化中确实存在“温度临界点”;在“温度临界点”前后薄膜结构性能的变化规律曲线出现拐点。进而推论:薄膜的结构性能在随温度变化中“温度临界点”可能不止一个。
In this paper, firstly, the “critical temperature point” exists in the change of film structure properties from the theoretical point of view. Then, the crystallization process, grain growth and properties of Si films and AZO films were analyzed by means of XRD, Mutation in the “critical temperature.” The results show that there is indeed a “critical temperature point” in the structural properties change of the film, and the inflection point appears in the regularity curve of the film structure before and after the “critical temperature point”. Further inference: the structural properties of the film with the temperature changes in the “temperature critical point” may be more than one.