江苏省2009年5月17日无锡市与韩国(株)海力士半导体共同投资3.5亿美元建设的大规模集成电路封装测试项目在南京正式签约。该项目建成后,将成为国内规模最大、技术最先进的12英寸大规模集成电路封装测试企业,有效提升了我国集成电路产业链能级,推动我国集成电路产业链发展进入了 Jiangsu Province May 17, 2009 Wuxi City and South Korea (strain) Hynix Semiconductor 350 million US dollars investment in the construction of large-scale integrated circuit packaging test project was officially signed in Nanjing. After the completion of the project, it will become the largest and most technologically advanced 12-inch large scale IC packaging and testing enterprise in China, effectively raising the level of China’s IC industry chain and promoting the development of China’s IC industry chain