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通过磁控溅射沉积TiN/Ag金属化层作为Cu焊盘的保护层,非晶态的TiN膜作为阻挡层,阻止Cu原子的向外扩散;选择能够与Au丝形成固溶体的Ag薄膜作为键合层,提高超声键合性能.超声键合性能测试和抗氧化性能测试表明,TiN/Ag金属化层结构作为Cu焊盘保护层,具有较好的键合能力,其键合能力和焊点剪切强度在20—180℃的温度范围内随着温度的升高而升高,在180℃时获得了100%的键合能力,剪切断裂发生在Au球与TiN/Ag键合面.TiN/Ag金属化层较相同厚度的Ag膜具有更强的抗氧化性能,原因在于非晶态TiN层对Cu原子的扩散起到了很好的阻挡作用.
The TiN / Ag metallization layer was deposited by magnetron sputtering as the protective layer of the Cu pad and the amorphous TiN film was used as a barrier layer to prevent the outward diffusion of Cu atoms. Ag thin films capable of forming a solid solution with the Au filaments were selected as the bond The results show that the TiN / Ag metallization layer as the protective layer of Cu pad has better bonding ability, the bonding ability and the solder joint The shear strength increases with the increase of temperature in the range of 20-180 ℃. At 180 ℃, the bond strength is 100%. Shear fracture occurs on the Au ball and TiN / Ag bonding surface. The TiN / Ag metallization layer has stronger oxidation resistance than the Ag film of the same thickness because the amorphous TiN layer is a good barrier to the diffusion of Cu atoms.