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A review of processing of Cu/C base plate composites for interfacial control and improved properties
[期刊论文] 作者：Jean-FranoisSilvain,Jean-MarcHeintz,AmélieVeillere,LoicConstantin,YongFengLu,
来源：InternationalJournalofExtremeManufacturing 年份：2020
The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials with a high thermal conductivity and thermal expansion coefficient compatible ......
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