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Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composit
[期刊论文] 作者：LEI Hong BU Naijing ZHANG Zefa,
来源：中国机械工程学报 年份：2010
Abrasive is the one of key influencing factors during chemical mechanical polishing(CMP) process. Currently, α-Alumina (α-Al2O3) particle, as a kind of abrasi...
Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composit
[期刊论文] 作者：LEI Hong,BU Naijing,ZHANG Zefang,CHEN Ruling,
来源：中国机械工程学报 年份：2010
Abrasive is the one of key influencing factors during chemical mechanical polishing(CMP) process. Currently, α-Alumina (α-Al2O3) particle, as a kind of abrasi...
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