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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joi
[期刊论文] 作者：YAN Yanfu,YAN Hongxing,CHEN Fuxiao,ZHANG Keke,ZHU Jinhong,
来源：稀有金属（英文版） 年份：2007
Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to exami...
[期刊论文] 作者：Liu Longlong,Luo Ming,Chen Fuxiao,Tan Wei,Zhang Junbin,Li Xiangmin,,
来源：Animal Husbandry and Feed Science 年份：2015
A starvation trial was conducted to determine compensatory growth of the juvenile golden pompano Trachinotus ovatus which were deprived of food for 1,2,5 and 7...
[期刊论文] 作者：HUANG Tao,WANG Kun,ZHAN Mei,GUO Junqing,CHEN Xuewen,CHEN Fuxiao,SONG Kexing,
来源：上海交通大学学报（英文版） 年份：2019
A finite element (FE) model for the numerical control (NC) bending of Ti-3Al-2.5V titanium alloy seamless tube is established,considering the variation in the c...
[期刊论文] 作者：ZHANG Si,LIU Cui,JIN Yuemei,CHI Shan,TANG Xianming,CHEN Fuxiao,FANG Xu,LIU Tao,
来源：黑龙江科技信息 年份：2014
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