搜索筛选:
搜索耗时2.8795秒,为你在为你在102,285,761篇论文里面共找到 1 篇相符的论文内容
类      型:
[会议论文] 作者:Chaoxuan Shen, You Zeng, 来源:第二十一届国际复合材料大会摘要集—专题一 年份:2018
<正>The miniaturization of electronic components has urgent demands of quick heat dissipation for maintaining normal working temperature of devices.Thermal interface materials (TIMs) are playing an ess...
相关搜索: