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Electrical Characterization of the through Via in Package-on-Package with Interposer using Parameter
[期刊论文] 作者：Young-Min Yoon,No-Su Kim,Eun-H,
来源：测试科学与仪器：英文版 年份：2010
【正】This paper describes a method to extract electrical parameters of the through via in Package-on-Package(PoP)with interposer.Using the de-embedding techniq...
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