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Exploring water and ion transport process at silicone/copper interfaces using in-situ electrochemica
[期刊论文] 作者：B.Munirathinam,J.P.B.van Dam,A.Herrmann,W.D.van Driel,F.De Buyl,S.J.F.Erich,L.G.J. van der Ven,O.C.G.Adan,
来源：材料科学技术（英文版） 年份：2021
In general,packaging materials which encapsulate light emitting diodes (LEDs) and microelectronic devices offer barrier protection against several environmental...
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