搜索筛选:
搜索耗时4.3374秒,为你在为你在102,285,761篇论文里面共找到 1 篇相符的论文内容
发布年度:
Stress behavior at crack tip on thinner silicon chip surface with nanostructures by finite element a
[会议论文] 作者：Meng-Kao Yeh,Chien-Ming Kao,J.Andrew Yeh,Chuck Hsu,
来源：The 5th Asian Conference on Mechanics of Functional Material 年份：2016
Thinning of silicon chip is necessary to save silicon material and to use it more efficiently in solar cell industry.However,the process of thinning silicon...
相关搜索：
