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[会议论文] 作者:Shuai Na,Lawrence Wong,Albert I.H.Chen,Zhenhao Li,John T.W.Yeow,
来源:2015两岸超声技术与医学研讨会 年份:2015
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[会议论文] 作者:Zhenhao Li,Albert I.H.Chen,Shuai Na,Lawrence Wong,John T.W.Yeow,
来源:2015两岸超声技术与医学研讨会 年份:2015
Background,Motivation and Objective Wafer bonding is often a preferred method over surface micromachining for CMUT fabrication because the resulting membrane layer is more uniform and can be easily op...
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