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[期刊论文] 作者：YANG Fan,SHI Tielin,LIAO Guanglan,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2014
We investigated the effects of heating rate on the process parameters of superplastic forming for Zr55Cu30Al10Ni5 by differential scanning calorimetry. The continuous heating and isothermal annealing analyses suggested that the temperatures......
[期刊论文] 作者：CHEN Biao,SHI Tielin,LIAO Guanglan,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2014
The laser bonding technology between the Zr41Ti14Cu12Ni10Be23 bulk metallic glass and zirconium metal was investigated under welding parameters of 1.3 kW and 7 m/min. The welded bead, microstructure, and micro-hardness of the welded joint w......
Deformation Behavior of Zr65Cu17.5Ni1oAl7.5 in Superplastic Forming with Silicon Mould: Simulation a
[期刊论文] 作者：YANG Fan,SHI Tielin,YU Qiang,LIAO Guanglan,
来源：武汉理工大学学报（材料科学版）（英文版） 年份：2014
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[期刊论文] 作者：WU Wenjun,XIE Hengfeng,LIAO Guanglan,SHI Tielin,NIE Lei,,
来源：Wuhan University Journal of Natural Sciences 年份：2016
This paper investigates the selective liquid response for Morpho didius butterfly wing scales and propose an optical model to explain the effect of different co...
[期刊论文] 作者：WU YouNi,JIANG Ting,SHI TieLin,SUN Bo,TANG ZiRong,LIAO GuangLan,,
来源：Science China(Technological Sciences) 年份：2017
We demonstrated the application of sensors for ethanol gas detection.The ZnO nanowires based sensors with interdigital electrodes were fabricated,and a platform...
Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted co
[期刊论文] 作者：LU XiangNing,SHI TieLin,WANG SuYa,LI Li Yi,SU Lei,LIAO GuangLan,,
来源：Science China(Technological Sciences) 年份：2015
Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more dif...
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