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[期刊论文] 作者：R.H.Poelma,S.Tarashioon,H.W.van Zeijl,S.Goldbach,J.L.J.Zijl,G.Q.Zhang,,
来源：Journal of Semiconductors 年份：2013
An ultra-thin multi-LED package is designed,manufactured and its thermal performance is characterized. The objective of this study is to develop an efficient th...
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