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[会议论文] 作者：S.L.Wang,Y.J Yuan,Y.L.Liu,X.H.Niu,
来源：Fifth International Conference on Surface Engineering(第五届表面工 年份：2007
Copper has replaced aluminum as the main interconnect material due to its low resistivity and high electromigration resistance.It is the most promising candidate for next generation technology provide...
[会议论文] 作者：S.L.Wang[1]Y.JYuan[2]Y.L.Liu[1]X.H.Niu[1],
来源：Fifth International Conference on Surface Engineering(第五届表面工 年份：2007
Copper has replaced aluminum as the main interconnect material due to its low resistivity and high electromigration resistance.It is the most promising cand...
Temperature-dependent Fermi Surface evolution and band-dependent hybridization of CeCoIn5 studied by
[会议论文] 作者：Q.Y.Chen,R.Peng,H.C.Xu,D.F.Xu,X.H.Niu,H.Q.Yuan,S.Kirchner,L.Shu,V.N.Strocov,P.Dudin,M.Hoesch,D.L.Feng,
来源：2015杭州量子物质国际研讨会( Internationale Conference on Strongly-Corre 年份：2015
...
A unifying phase diagram with correlation-driven superconductor-to-insulator transition for the 122*
[会议论文] 作者：X.H.Niu,S.D.Chen,J.Jiang,Z.R.Ye,T.L.Yu,D.F.Xu,M.Xu,Y.Feng,Y.J.Yan,B.P.Xie,J.Zhao,D.C.Gu,L.L.Sun,Qianhui,
来源：2015杭州量子物质国际研讨会( Internationale Conference on Strongly-Corre 年份：2015
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