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[期刊论文] 作者：XIA Chenhui,WANG Gang,WANG Bo,,
来源：中兴通讯技术:英文版 年份：2020
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technol...
[期刊论文] 作者：XIA Chenhui,WANG Gang,WANG Bo,MING Xuefei,
来源：中兴通讯技术（英文版） 年份：2020
A 3D fan-out packaging method for the integration of 5G communication RF mi-crosystem and antenna is studied. First of all, through the double-sided wiring tech...
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