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[会议论文] 作者：S.L.Wang,Y.J Yuan,Y.L.Liu,X.H.Niu,
来源：Fifth International Conference on Surface Engineering(第五届表面工 年份：2007
Copper has replaced aluminum as the main interconnect material due to its low resistivity and high electromigration resistance.It is the most promising candidate for next generation technology provide...
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